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  for further information contact your local stmicroelectronics sales office. december 2013 docid025664 rev 1 1/3 3 stpay-j-d08d-ax vsdc, m/chip and interac applications java card? platform with 8 kbytes of eeprom ? dual interface data brief features ? java card? platform ? embedded interac?, visa? smart debit credit (vsdc) and mastercard? m/chip? emv applications ? visa, mastercard and interac certified platform ? java card? 2.2.2 operating system ? global platform? 2.1.1 api support ? common personalization specification (cps) compliant ? iso/iec 7816 t=0 and t=1 contact protocols ? iso/iec 14443 type a and type b contactless interfaces hardware ? st31 arm? securcore? sc000? 32-bit risc core ? 8 kbytes of user eeprom applications ? payment applications embedded in rom ? mastercard m/chip advance 1.1 and m/chip 1.1b select for emv payment applications ? visa vsdc 2.8.1f for emv dda payment applications ? interac 1.4 emv payment applications ? paypass 1.3.1, paywave 2.1.1 and interac flash 1.4 for contactless payments ? cap (chip authentication protocol) and dpa (dynamic passcode authentication) ? pse 2.2 (payment system environment) for application selection cryptography ? nescrypt cryptographic co-processor for rsa and elliptic curve cryptography ? enhanced des accelerator (edes) for des and 3des support personalization ? emv cps v2.0 compliant ? vsdc personalization specification v 2.0 ? m/chip 4 v1.1 common personalization specification certifications ? visa? vsdc ? mastercard? m/chip ? interac delivery forms ? 6-contact d70 (gold) and d72 (silver) modules ? sawn/unsawn wafers wafer d72 silver micromodule d70 gold micromodule www.st.com
description stpay-j-d08d-ax 2/3 docid025664 rev 1 1 description the stpay-j-d08d-ax is a java card? vgp 2.1.1 platform for payment applications with 8 kbytes of user non volatile memory. the stpay-j-d08d-ax has visa vsdc dda, mastercard m/chip advance, m/chip 4 select and interac flash payment applications pre-loaded in rom. these applications support visa paywave, mastercard paypass and interac flash contactless payments. the stpay system-on-chip (soc) family is a packaged offering by st, comprising a highly secure microcontroller, embedded application sw, tools and support, aimed at serving the needs of card embedders and personalization bureaus worldwide. 2 development tools the stpay tool is an easy to use toolkit that allows issuers and service providers to: ? develop, test and install java applets ? personalize, test and validate stpay-java sample cards the tool comes with sample personalization scripts for vsdc and m/chip to facilitate script development/validation and rapid card deployment. 3 revision history table 1. document revision history date revision changes 20-dec-2013 1 initial release.
docid025664 rev 1 3/3 stpay-j-d08d-ax please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. a ll st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industr y domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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